Gehäusetypen: Unterschied zwischen den Versionen
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(Die Seite wurde neu angelegt: „{| class="wikitable" | Gehäusetyp || Beschreibung |- | SOIC || Small Outline Integrated Circuit |- | QFP || Quad Flat Package |- | TQFP || Thin Quad Flat Package |- | QFN || Quad Flat No-Lead |- | DIP || Dual Inline Package |- | SOT || Small Outline Transistor |- | SSOP || Shrink Small Outline Package |- | MSOP || Mini Small Outline Package |- | LGA || Land Grid Array |- | BGA || Ball Grid Array |- | CSP || Chip Scale Package |- | PLCC || Plastic Leaded…“) |
(kein Unterschied)
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Aktuelle Version vom 26. August 2023, 15:43 Uhr
| Gehäusetyp | Beschreibung |
| SOIC | Small Outline Integrated Circuit |
| QFP | Quad Flat Package |
| TQFP | Thin Quad Flat Package |
| QFN | Quad Flat No-Lead |
| DIP | Dual Inline Package |
| SOT | Small Outline Transistor |
| SSOP | Shrink Small Outline Package |
| MSOP | Mini Small Outline Package |
| LGA | Land Grid Array |
| BGA | Ball Grid Array |
| CSP | Chip Scale Package |
| PLCC | Plastic Leaded Chip Carrier |
| TO | Transistor Outline |